Viasion technology co.,ltd
5 1

FR4 + PI 6 Layers Rigid Flex PCB Immersion Gold For Robotic Surgery Systems

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Viasion technology co.,ltd
[China]

Address
Room�331,Famous�ndustry�roduction�xhibition Center beijing beijing
Phone
86-755-26735910
Contact name
Ross

Quick Information

  • Brand Name: VIASION
  • Place of Origin: China
  • Model Number : VP103

Description

FR4 + PI 6 Layers Rigid Flex PCB Immersion Gold For Robotic Surgery Systems

Specification:

Material

FR4 + PI

Layer count

6 layers

Board thickness

1.6mm

Copper thickness

1oz

Minimum drill size

0.2mm

Minimum trace & gap

0.2mm

Surface finish

Immersion gold

Applications

Medical equipment  

Special Technology

NO

Buried vias: layer 2-7, 3-6

Applications:


Communications
Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.

Computer Peripherals
High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.

Consumer
Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.

Automotive
Passenger safety systems, engine control systems, air bags, traction control products, etc.

High End Computing and Storage
High performance computer and server, mainframe system and storage equipment, memory, etc.

Industry
Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc

Medical
Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.

Military
Satellite, radar, airplane, control unit, communication equipment .etc.

Test & Measurement
Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.


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